Silicone Adhesive

  • Pressure Sensitive Adhesive PSA-01
Pressure Sensitive Adhesive PSA-01

Pressure Sensitive Adhesive PSA-01

  • Sunoit Code: PSA-01
  • Type: Pressure Sensitive Adhesive
  • Solid content: 60%
  • Similar: DOWSIL™ 280A
  • Description: PSA-01 is a high viscous dispersion of polymethylsiloxane gum and resin. It is diluted with toluene to 60% silicone solids content.
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Description

PSA-01 is a high viscous dispersion of polymethylsiloxane gum and resin. It is diluted with toluene to 60% silicone solids content.

Product Data

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Application

• For the production of refractory mica tape and high temperature pressure sensitive adhesive tape.
• For shading and sheet metal tape.

How to use

The product can be directly coated on the base material with traditional tape coating equipment. You can further dilute the adhesive with compatible solvent such as toluene and xylene. The recommended working liquid concentration is 15~20%. When using the solvents, pls ensure the ventilation and comply with safety precautions and regulations of solvent suppliers.The peroxide can be used as curing agent, such as BPO or DPP, and BPO is recommended. The recommended dosage is 1.0-3.0% of the adhesive. The curing agent can be used to accelerate the curing speed, and it can also improve the cohesion of the adhesive.
When using BPO, it should be dissolved in toluene, going to be 10% solution, which can achieve the best mixing with the adhesive. The mixed peroxide dispersion liquid should be used up within 1-2 days.The sufficient dispersion of adhesive and peroxide in the mixing process is necessary to ensure the consistency of the finished product.
Surface curing cycle: 60 ~ 90 ℃ * 1 min Eliminate the solvent to ensure that there is no solvent in the glue when it enters the solidification zone; 140 ~ 170 ℃ * 2 min, through the thermal curing to further improve the adhesive force, cohesive strength and initial adhesion.If the equipment and substrate allow higher curing temperature, the curing time can be shortened. Compared to low temperature curing, raising the curing temperature can increase the cohesive strength of the adhesive in a shorter time.




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